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 3SK323
Si Nch Dual Gate MOS FET UHF RF LOW NOISE Amplifier
REJ03G0531-0100 Rev.1.00 May 18.2005
Features
* * * * Low noise characteristics; NF = 1.0 dB typ. (at f = 900 MHz) High gain characteristics; PG = 24 dB typ. (at f = 900 MHz) Capable low voltage operation; +B = 3.5 V High Endurance Voltage; VDS = 6 V
Outline
RENESAS Package code: PLSP0004ZA-A (Package name: MPAK-4)
2 3 1 4
1. Source 2. Gate1 3. Gate2 4. Drain
Notes:
1. Marking is "UG-".
Absolute Maximum Ratings
(Ta = 25C)
Item Drain to source voltage Gate1 to source voltage Gate2 to source voltage Symbol VDS VG1S VG2S Ratings 6 +6 -6 +6 -6 20 300 150 -55 to +150 Unit V V V mA mW C C
Drain current ID Channel power dissipation Pch*2 Channel temperature Tch Storage temperature Tstg Notes: 2. Value on the glass epoxy board (50 mm x 40 mm x 1 mm).
Rev.1.00, May 18,2005, page 1 of 7
3SK323
Electrical Characteristics
(Ta = 25C)
Item Drain to source breakdown voltage Gate1 to source breakdown voltage Gate2 to source breakdown voltage Gate1 to source cutoff current Gate2 to source cutoff current Gate1 to source cutoff voltage Gate2 to source cutoff voltage Forward transfer admittance Power gain Noise figure Symbol V(BR)DSS V(BR)G1SS V(BR)G2SS IG1SS IG2SS VG1S(off) VG2S(off) |yfs| PG NF Min 6 6 6 -- -- 0 0.3 30 20 -- Typ -- -- -- -- -- 0.5 0.7 42 24 1.0 Max -- -- -- 100 100 1 1.1 -- -- 1.6 Unit V V V nA nA V V mS dB dB Test Conditions ID = 200 A, VG1S = VG2S = 0 IG1 = 10 A, VG2S = VDS = 0 IG2 = 10 A, VG1S = VDS = 0 VG1S = 5 V, VG2S = VDS = 0 VG2S = 5 V, VG1S = VDS = 0 VDS = 5 V, VG2S = 3V, ID = 100 A VDS = 5 V, VG1S = 3 V, ID = 100 A VDS = 3.5 V, ID = 10 mA, VG2S = 3 V, f = 1 kHz VDS = 3.5 V, ID = 10 mA, VG2S = 3 V, f = 900 MHz
900MHz PG, NF Test Circuit
VG1 VG2 C4 C5 VD C6
R1
R2 C3 G2
R3 D L3
RFC Output (50 ) L4
Input (50 ) L1 L2
G1 S
C1
C2
C1, C2 C3 C4 to C6 R1 R2 R3 L1: 10
: : : : : :
Variable Capacitor (10 pF MAX) Disk Capacitor (1000 pF) Air Capacitor (1000 pF) 47 k 47 k 4.7 k L2:
10
26
(1 mm Copper wire) Unit : mm
8
21 L3: 29 L4: 18
3
10
7
7
RFC : 1mm Copper wire with enamel 4 turns inside dia 6 mm
Rev.1.00, May 18,2005, page 2 of 7
10
3
3SK323
Main Characteristics
Maximum Channel Power Dissipation Curve
Pch (mW)
400
(mA)
20 1.3 V
Typical Output Characteristics VG2S = 3 V 1.2 V 1.1 V
300
15 1.0 V 10 0.9 V 5 VG1S = 0.6 V 0.8 V 0.7 V 4 5 VDS (V)
Channel Power Dissipation
100
Drain Current
200
ID
0
50
100
150 Ta (C)
200
0
0
Ambient Temperature
1 2 3 Drain to Source Voltage
Note 3 : When using the glass epoxy board (50 mm x 40 mm x 1 mm )
20
(mA)
Drain Current vs. Gate1 to Source Voltage VDS =3.5 V 3.0 V
(mA)
20
Drain Current vs. Gate1 to Source Voltage VDS = 5 V 3.0 V 2.5 V 2.0 V 1.5 V
2.5 V 15 2.0 V 1.5 V 10
15
ID
Drain Current
Drain Current
ID
10
5 1.0 V VG2S = 0.5 V 0 0.0 0.5 1.0 1.5 2.0 Gate1 to Source Voltage VG1S (V)
5 1.0 V 0 0.0 0.5 1.0 Gate1 to Source Voltage VG2S = 0.5 V 1.5 VG1S 2.0 (V)
Forward Transfer Admittance vs. Gate1 to Source Voltage
Forward Transfer Admittance |yfs| (mS) Forward Transfer Admittance |yfs| (mS)
Forward Transfer Admittance vs. Gate1 to Source Voltage 50 40 30 20 2.5 V 10 1.5 V 1.0 V 0 0.0 0.5 1.0 Gate1 to Source Voltage 1.5 VG1S 2V VDS = 5 V VG2S = 3 V
50 40
VDS = 3.5 V
30
VG2S = 3 V 2.5 V
20 10 0 0.0 0.5 1.0 Gate1 to Source Voltage 1.0 V 1.5 V 1.5 VG1S
2V
2.0 (V)
2.0 (V)
Rev.1.00, May 18,2005, page 3 of 7
3SK323
Gain Reduction vs. Gate2 to Source Voltage ID = 10 mA (start) f = 900 MHz Drain Current vs. Power Gain, Noise Figure PG
40
30
3.0
Gain Reduction GR (dB)
35 30 25 20 15 10 5 0 VDS = 3.5 V 0 1 2
20
2.0
NF 10 VDS = 3.5 V VG2S = 3.0 V f = 900 MHz 0 1.0
5V
3
4 (V)
0
5
10 ID
15 (mA)
0.0 20
Gate2 to Source Voltage VG2S
Drain Current
30
Gate2 to Source Voltage vs. Power Gain, Noise Figure PG
3.0
Drain to Source Voltage vs. Power Gain, Noise Figure 30 3.0
Noise Figure NF (dB)
PG 20 2.0
20
2.0
10
NF VDS = 3.5 V ID = 10 mA (start) f = 900 MHz 1.5 2.0 2.5
1.0
NF 10 VG2S = 3.0 V ID 10 mA f = 900 MHz 1 2 3 4 VDS (V) 5 1.0
0 1.0
0.0 3.0
0
0.0
Gate2 to Source Voltage VG2S
(V)
Drain to Source Voltage
Maximum Stable Gain vs. Drain Current 30 30
Maximum Stable Gain vs. Drain Current
Maximum Stable Gain MSG (dB)
Maximum Stable Gain MSG (dB)
5V 25 20 15 10 5 0 0 VG2S = 3.0 V f = 900 MHz 15 20 ID (mA) VDS = 3.5 V
25 20 15
VG2S = 3.0 V f = 2 GHz
5V 10 5 0 0 5 10 ID 15 (mA) 20 Drain Current VDS = 3.5 V
5
10
Drain Current
Rev.1.00, May 18,2005, page 4 of 7
Noise Figure NF (dB)
Power Gain PG (dB)
Power Gain PG (dB)
Noise Figure NF (dB)
Power Gain PG (dB)
3SK323
Maximum Stable Gain vs. Frequency 40
Maximum Stable Gain MSG (dB)
30 20 10 VDS = 3.5 V VG2S = 4 V ID = 10 mA 0.5 1.0 1.5 2.0 f (GHz) 2.5 3.0
0 -10 0.0
Frequency
Rev.1.00, May 18,2005, page 5 of 7
3SK323
S parameter
(VDS = 3.5 V, VG2S = 4 V, ID = 10 mA, Zo =50 )
S11 f (GHz) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 Mag 0.996 0.989 0.973 0.956 0.940 0.920 0.899 0.879 0.858 0.840 0.816 0.794 0.772 0.752 0.734 0.727 0.754 0.825 0.877 0.890 0.882 0.867 0.851 0.834 0.816 0.795 0.771 0.744 0.713 0.677 Phase -6.0 -11.7 -17.1 -22.6 -27.8 -32.9 -37.7 -42.4 -46.9 -51.3 -55.5 -59.3 -62.8 -66.0 -68.5 -69.7 -70.0 -73.3 -80.3 -88.0 -94.7 -100.9 -106.6 -112.1 -117.5 -122.8 -128.1 -133.2 -138.1 -142.4 Mag 4.33 4.23 4.15 4.06 3.94 3.84 3.73 3.62 3.52 3.42 3.30 3.19 3.08 2.97 2.84 2.63 2.28 1.77 1.47 1.45 1.52 1.56 1.58 1.56 1.54 1.50 1.47 1.43 1.39 1.36 S21 Phase 170.1 160.5 151.2 142.1 133.5 125.0 116.7 108.6 100.5 92.5 84.4 76.2 67.8 59.2 49.4 38.2 26.6 20.3 24.7 29.7 28.9 25.0 19.9 14.4 8.8 3.2 -2.2 -7.7 -12.9 -18.3 Mag 0.002 0.003 0.003 0.004 0.004 0.003 0.004 0.005 0.010 0.014 0.020 0.028 0.036 0.048 0.058 0.069 0.079 0.092 0.111 0.136 0.162 0.192 0.223 0.256 0.294 0.333 0.374 0.416 0.458 0.497 S12 Phase 139.0 84.8 96.9 75.9 82.6 91.7 132.5 157.1 169.9 173.8 174.8 175.0 169.6 165.1 160.8 156.3 152.6 152.4 150.7 147.2 142.4 136.6 130.5 123.9 117.3 109.8 101.9 93.6 84.6 74.7 Mag 0.992 0.988 0.978 0.963 0.948 0.931 0.915 0.899 0.883 0.869 0.857 0.846 0.838 0.835 0.837 0.849 0.867 0.869 0.847 0.818 0.796 0.780 0.766 0.753 0.739 0.724 0.706 0.681 0.654 0.624 S22 Phase -6.1 -11.9 -17.7 -23.5 -28.9 -34.4 -39.6 -44.7 -49.7 -54.5 -59.3 -63.9 -68.5 -72.9 -77.3 -82.4 -88.1 -95.5 -102.1 -108.0 -112.9 -117.7 -122.4 -127.3 -132.2 -137.2 -142.2 -146.9 -151.2 -154.8
Rev.1.00, May 18,2005, page 6 of 7
3SK323
Package Dimensions
JEITA Package Code SC-61AA RENESAS Code PLSP0004ZA-A Package Name MPAK-4 / MPAK-4V MASS[Typ.] 0.013g
D e2 b1 B B e
A Q c
E
HE
Reference Symbol Dimension in Millimeters
L A A xM S A b
L1 A3 e2
LP
e
A2
A
I1
b5 yS A1 S e1
b b2 c c1 c
b1 b3 c1
I1
b4
A-A Section
B-B Section
Pattern of terminal position areas
A A1 A2 A3 b b1 b2 b3 c c1 D E e e2 HE L L1 LP x y b4 b5 e1 I1 Q
Min 1.0 0 1.0 0.35 0.55
Nom
0.1 2.7 1.35
1.1 0.25 0.42 0.62 0.4 0.6 0.13 0.11 1.5 0.95 0.85 2.8
Max 1.3 0.1 1.2 0.5 0.7
0.15 3.1 1.65
2.2 0.35 0.15 0.25
3.0 0.75 0.55 0.65 0.05 0.05 0.55 0.75 1.05
1.95 0.3
Ordering Information
Part Name 3SK324UGQuantity 3000 pcs. Taping Shipping Container
Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product.
Rev.1.00, May 18,2005, page 7 of 7
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001
http://www.renesas.com
(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .2.0


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